Features
- Incredibly dense with up to 240 total I/Os; up to 400 in development
- Low profile 5 mm stack height
- Slim 5 mm width
- 4-row design; 10 – 60 positions per row (40 – 240 total positions)
- Edge Rate® contact system optimized for signal integrity performance
- Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
- Solder ball technology for simplified processing and self aligning
- Additional stack heights in development
