Wave Series BGA Heat Sink


Mechanical Dimensions (mm)

Part #  Attachment Method Length Width Fin Width Height Surface Area (sq mm) Height Off Base (Fin Height) Thermal Res. @200 LFM
WAVE-26-12 Spring-Anchor 26 26 52.9 12 8305.2 10 5.21
WAVE-29-127 Spring-Anchor 29 29 61.4 12.7 11810.5 10.7 4.08
WAVE-32-12 Spring-Anchor 32 32 50.2 12 10957.5 10 4.64
WAVE-34-21 Spring-Anchor 34 34 70 21 21268.4 19 2.19
WAVE-35-12 Spring-Anchor 35 35 62 12 15180.8 10 3.83
WAVE-35-125 Spring-Anchor 35 35 63.3 12.5 15792.6 10.5 3.63
WAVE-35-15 Spring-Anchor 35 35 58.1 15 15612.7 13 3.15
WAVE-35-21 Spring-Anchor 35 35 74.6 21 21721.8 19 2.11
WAVE-366-175 Spring-Anchor 36.6 36.6 63.6 17.5 18637.8 15.5 2.55
WAVE-40-12 Spring-Anchor 40 40 66.9 12 17689.4 10 3.36
WAVE-40-125 Spring-Anchor 40 40 68.3 12.5 18410.1 10.5 3.16
WAVE-425-117 Spring-Anchor 42.5 42.5 67.4 11.7 21668.3 9.3 3.4
WAVE-45-12 Spring-Anchor 45 45 72 12 22303.7 10 2.96

Features & Benefits

  • Approximately 12% better thermal performance than traditional footprint heat sinks
  • Height- A low profile design allows for more surface area in a height restricted application
  • Clipping mechanism included with heat sink
  • Surface Area-  Fin array allows for more surface area for forced convection
  • Easily customization
  • Easily compatible with major BGA device manufacturers components such as: Broadcomm, Motorola, Freescale, TI, Intel, etc.

Material Specifications

  • Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish.
  • Spring Clip: 304 Stainless Steel, 1.2mm [0.47″] DIA
  • RoHS Compliant

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