Wave Series BGA Heat Sink
The Wakefield-Vette Wave Series Heat Sink Series are a superior choice for cooling BGA applications in which limited height/footprint while achieving maximum surface area. The Wave Series Heat Sinks include a unique clipping mechanism that allows for superior heat transfer while securing the heat sink to the BGA itself. The clipping mechanism allows for easy installation in high production assembly.
Description
Mechanical Dimensions (mm) |
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| Part # | Attachment Method | Length | Width | Fin Width | Height | Surface Area (sq mm) | Height Off Base (Fin Height) | Thermal Res. @200 LFM |
| WAVE-26-12 | Spring-Anchor | 26 | 26 | 52.9 | 12 | 8305.2 | 10 | 5.21 |
| WAVE-29-127 | Spring-Anchor | 29 | 29 | 61.4 | 12.7 | 11810.5 | 10.7 | 4.08 |
| WAVE-32-12 | Spring-Anchor | 32 | 32 | 50.2 | 12 | 10957.5 | 10 | 4.64 |
| WAVE-34-21 | Spring-Anchor | 34 | 34 | 70 | 21 | 21268.4 | 19 | 2.19 |
| WAVE-35-12 | Spring-Anchor | 35 | 35 | 62 | 12 | 15180.8 | 10 | 3.83 |
| WAVE-35-125 | Spring-Anchor | 35 | 35 | 63.3 | 12.5 | 15792.6 | 10.5 | 3.63 |
| WAVE-35-15 | Spring-Anchor | 35 | 35 | 58.1 | 15 | 15612.7 | 13 | 3.15 |
| WAVE-35-21 | Spring-Anchor | 35 | 35 | 74.6 | 21 | 21721.8 | 19 | 2.11 |
| WAVE-366-175 | Spring-Anchor | 36.6 | 36.6 | 63.6 | 17.5 | 18637.8 | 15.5 | 2.55 |
| WAVE-40-12 | Spring-Anchor | 40 | 40 | 66.9 | 12 | 17689.4 | 10 | 3.36 |
| WAVE-40-125 | Spring-Anchor | 40 | 40 | 68.3 | 12.5 | 18410.1 | 10.5 | 3.16 |
| WAVE-425-117 | Spring-Anchor | 42.5 | 42.5 | 67.4 | 11.7 | 21668.3 | 9.3 | 3.4 |
| WAVE-45-12 | Spring-Anchor | 45 | 45 | 72 | 12 | 22303.7 | 10 | 2.96 |
Features & Benefits
- Approximately 12% better thermal performance than traditional footprint heat sinks
- Height- A low profile design allows for more surface area in a height restricted application
- Clipping mechanism included with heat sink
- Surface Area- Fin array allows for more surface area for forced convection
- Easily customization
- Easily compatible with major BGA device manufacturers components such as: Broadcomm, Motorola, Freescale, TI, Intel, etc.
Material Specifications
- Heat Sink: Aluminum Alloy 6063-T5 with black anodized finish.
- Spring Clip: 304 Stainless Steel, 1.2mm [0.47″] DIA
- RoHS Compliant
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