Showing all 8 results
The Nano SIM (also known as the 4FF) card only measure 12.3 × 8.8 × 0.67 mm, the original design purpose was fit the mobile device. Even it reduces the area, it still maintaining the existing contact arrangements and provide all designer another solution to saving the cost in PCB layout design. As the professional communication solution provider, ATTEND Tech offering the maximizing options to fit with any request, including the bar push eject type with multiple tray option, push-push type, hinge type and dual bar push eject type.
M.2 connector, also known as the Next Generation Form Factor (NGFF) is originally designed for the ultra-thin products. Its compact size could save over 20% of PCB design space compare with mini PCIe connector. M.2 connector applies to high-speed data transmission that supports PCI Express 3.0, SATA 3.0 and USB 3.0.
DDR4 SODIMM Socket, Horizontal 9.2H, RVS, G/F, Black, Reel, Solder PEG
Since SO-DIMM roughly half the size of regular DIMMs, it often used in systems with limited space, such as laptops, notebooks, small-footprint personal computers, high-end upgradable office printers, and networking hardware…etc. ATTEND offers various selections from DDR2 to DDR4 with different types, including vertical and standard type.
MXM 3.0 Connector, 314 pin, H=7.8mm, Pith=0.5mm, 5u”
ATTEND’s MXM Series to meet the requirements of computer-on-modules for SMARC and Qseven specification. Now offers a 314-pin and 230-pin high-speed version.
Applications with an increased need for high-speed signal contacts are thus also accommodated.
|
Specification:
|
|
|
Item Model
|
ST-2080D Soldering Iron
|
|
Power Comsuption
|
80W
|
|
Voltage
|
110V-230V
|
|
Heating Element
|
quad-core ceramic heater
|
|
Temperature accuracy
|
± 10°C
|
|
Temperature range
|
250-520°C
|
|
Heating indication
|
Heating indication
|
|
Control method
|
Control method
|
