Showing 1–24 of 147 results
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Features & Benefits Security of the push-pull sel-latching system. Multicontact types 2 to 4 contacts. Hybrid types (multcontact, high voltage, low voltage, coaxical). Solder, crimp or printed circuit contacts (straight or elbow). Keying system for connector allignment. Multiple key options to avoid cross mating of similar connectors. 360 deg. screening for full EMC shielding. 5,000...
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Features & Benefits Security of the push-pull sel-latching system. Multicontact types 2 to 9 contacts. Hybrid types (multcontact, high voltage, low voltage, coaxical). Solder, crimp or printed circuit contacts (straight or elbow). Keying system for connector allignment. Multiple key options to avoid cross mating of similar connectors. 360 deg. screening for full EMC shielding. 5,000...
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The W534811(xx)SA - Single Row and W534821(xx)SA - Dual Row Series header sockets use a gold plated phosphor bronze contact. The moulding material is 30% GF Nylon rated to UL 94 V-0. The (xx) in the part number relates to the number of pins required. Sockets are available up to 32 pins for the single...
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The W5811(xx)SB1RC - Single Row and W5821(xx)SB1RC - Dual Row Series headers use a gold plated phosphor bronze pin. Moulding material is 30% GF Nylon rated to UL 94 V-0. The (xx) in the part number related to the number of pins required. Headers are available up to 32 pins for the single row and...
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1.6-5.6 coaxial connectors with 75Ω impedance are generally designed for radio and digital signal transmissions. These 1.6-5.6 connectors have become popular in modern telecommunication equipments
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Nano SIM Socket, Tray-Push Push Type, 6 Pin, G/F
Introduce the novel ATTEND Nano SIM Card Socket, Tray Push-Push Type with Lock Robust against vibration with high Tray retention prevent card loss. For panel and casing design keep tray edge 2mm exposed space.
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The Nano SIM (also known as the 4FF) card only measure 12.3 × 8.8 × 0.67 mm, the original design purpose was fit the mobile device. Even it reduces the area, it still maintaining the existing contact arrangements and provide all designer another solution to saving the cost in PCB layout design. As the professional communication solution provider, ATTEND Tech offering the maximizing options to fit with any request, including the bar push eject type with multiple tray option, push-push type, hinge type and dual bar push eject type.
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Type: M Series
Current rating: 1A
Voltage rating: 60V
Contact resistance: ≤5mΩ
Insulation resistance: ≥100MΩ
Operating temperature:-25℃~90℃
Material plating:
- 1. Insulator: PA+GF
- 2. Connector contacts: Brass Gold Plated
- 3. Connector Nut/Screw: Brass Nickel Plated
- 4. Seal/O-Ring: Epoxy resin/FKM
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Type: M Series
Current rating: 1A
Voltage rating: 60V
Contact resistance: ≤5mΩ
Insulation resistance: ≥100MΩ
Operating temperature:-25℃~90℃
Material plating:
- 1. Insulator: PA+GF
- 2. Connector contacts: Brass Gold Plated
- 3. Connector Nut/Screw: Brass Nickel Plated
- 4. Seal/O-Ring: Epoxy resin/FKM
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Type: M Series
Current rating: 1A
Voltage rating: 60V
Contact resistance: ≤5mΩ
Insulation resistance: ≥100MΩ
Operating temperature:-25℃~90℃
Material plating:
- 1. Insulator: PA+GF
- 2. Connector contacts: Brass Gold Plated
- 3. Connector Nut/Screw: Brass Nickel Plated
- 4. Seal/O-Ring: Epoxy resin/FKM
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Type: M Series
Current rating: 4A(3、4、5Pin);2A(8Pin);1.5A(12Pin)
Voltage rating: 250V(3、4Pin);60V(5Pin);30V(8、12Pin)
Contact resistance:≤5mΩ
Insulation resistance:≥100MΩ
Operating temperature:-25℃~90℃
Material plating:
- 1. Insulator: PA+GF
- 2. Connector contacts: Brass Gold Plated
- 3. Connector Nut/Screw: Brass Nickel Plated
- 4. Seal/O-Ring: Epoxy resin/FKM
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M.2 connector, also known as the Next Generation Form Factor (NGFF) is originally designed for the ultra-thin products. Its compact size could save over 20% of PCB design space compare with mini PCIe connector. M.2 connector applies to high-speed data transmission that supports PCI Express 3.0, SATA 3.0 and USB 3.0.
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DDR4 SODIMM Socket, Horizontal 9.2H, RVS, G/F, Black, Reel, Solder PEG
Since SO-DIMM roughly half the size of regular DIMMs, it often used in systems with limited space, such as laptops, notebooks, small-footprint personal computers, high-end upgradable office printers, and networking hardware…etc. ATTEND offers various selections from DDR2 to DDR4 with different types, including vertical and standard type.
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MXM 3.0 Connector, 314 pin, H=7.8mm, Pith=0.5mm, 5u”
ATTEND’s MXM Series to meet the requirements of computer-on-modules for SMARC and Qseven specification. Now offers a 314-pin and 230-pin high-speed version.
Applications with an increased need for high-speed signal contacts are thus also accommodated.
- MXM 230 pin for QSeven, Pith 0.5mm, H=7.8mm
- MXM 3.0 for SMARC/EDM, 314Pin , Pith 0.5mm, H=7.8mm
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Features & Benefits Aesthetically pleasing design Multipole 2~14 pin Light weight Aluminum shielding with anodization in different colour Extensive sterilisation (over 100 cycles) Excellent electrical safety (touch & scoop proof) Wide choice of colours for easy identification (grey/blue/yellow/black/red/green/white) Large choice of keying to avoid cross mating Various contact types: solder, crimp, print and elbow print...
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Features & Benefits Aesthetically pleasing design Multipole 2~14 pin Light weight Copper shield with chromate plated Extensive sterilisation (over 100 cycles) Excellent electrical safety (touch & scoop proof) Large choice of keying to avoid cross mating Various contact types: solder, crimp, print and elbow print 90 deg. Disposable models Watertight connection (IP50) Over 2,000 mating...
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Single row
2.54/5.08 mm, Straight solder tail, Mating pin Ø 0.47 mm
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Single row
2.54/5.08 mm, Straight solder tail, Pin 0.47mm
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Conn Barrier Strip 6 POS 9.52mm Screw Panel Mount 50A
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Conn Barrier Strip 8 POS 11.11mm Solder ST Thru-Hole 20A
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Applied Engineering Products (AEP) 6001-7071-008 Connector
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Single Row
2.54 mm, Surface mount perpendicular
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Single Row
2.54 mm, Straight solder tail
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AEP 9443-1563-000 Coaxial Connector
