-

Completely halogen-free but short soldering time
The fast wetting and spread of SN100C (044) flux-cored solder wire makes it possible to complete a solder joint up to 30% faster than with previously available completely halogen-free flux-cored wire. Excellent wetting and spread ensure high first pass yields. Completely halogen-free. Does not contain F, Cl, Br or I.
Solder Speed Test (Average Ratio)
Approxmately 30% faster than previous product
-

Enables usage and storage under various circumstances
SN100C P506 D4 is a lead-free (Sn-Cu-Ni-Ge), no-clean solder paste that can be stored at room temperature for more than 60 days without deterioration. This new material will not only simplify stock management, but also improve productivity with excellent consecutive printability.
Consecutive Printability Test (8 hours per day in 1 week)
Good printability and stability of viscosity maintained during continuous printing.
-

High Activity Completely Halogen-Free Dispensing Grade Solder Paste
High reliability completely Halogen-Free Solder Paste based on Lead-Free solder alloy SN100C(Sn-0.7Cu-0.05Ni+Ge). Does not contain F, Cl, Br or I and offers superior dispensing stability that ensures no missed joints.
General Purpose Paste for 0402 (1005 metric) Chip Components.
Reflow 0402 (1005 metric) Chip Components
Left : After Dispensing
Right : After Reflow
SN100C P603 D4 enables excellent reflow