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TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
Product features：Good thermal conductivity, Extremely soft and cost effective
Typical applications：Networking and Telecommunications. IT: Notebooks, Tablets, Power Conversion
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TP 300 an extremely soft gap filler pad that also harnesses exceptional thermally conductive characteristics. TP 300 can meet the design needs of numerous design requirements and specifications. TP 300 will provide the innate thermal requirements your design needs without over stressing the components or cases.
Product features：Soft and highly compliant, Naturally tacky, easing application
Typical applications：Industrial: LEDs, Power Supplies and Conversion
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TP 400 elevates the thermal performance bar, achieving 4 W/ mK while maintaining a hardness of 55 (shore 00). The low hardness in comparison to thermal conductivity proves that TP 400 will meet the demands of your challenging design requirements.
Product features：Thermal conductivity: 4.0 W/m.k ， Low Silicone Oil Extraction
Typical applications：Industrial: LEDs, Power Supplies and Conversion
