This kit includes the tools and materials needed to reliably repair or replace damaged lands, surface mount and BGA pads.
The replacement circuits in this kit have a dry film, adhesive backing that is activated and cured with heat. This IPC recommended repair method restores your boards to their original level of performance and reliability.
Includes a Digital Temperature Controller, Bonding Iron and Bonding Tips to delivers the optimal heat required for curing the adhesive bonding film on the back side of the replacement lands and pads.
This kit that is specifically designed to make the repair process as simple and reliable as possible. All the tools and materials are packaged in a rugged ESD safe carrying case.
Features:
- Includes dry film, adhesive-backed replacement lands and pads that do not use messy liquid adhesives for bonding.
- Includes a Digital Temperature Controller, Bonding Iron and Bonding Tips.
- Includes epoxy for solder mask or base board repair.
- All the tools and materials are neatly arranged in a conductive, ESD safe carrying case.
- Tools and materials conform to IPC guidelines.
- Every item is prime quality, time-tested, to meet high standards.
