High frequency multi-layer chip inductors feature a monolithic body made of low loss ceramic and high conductivity metal electrodes to achieve optimal high frequency performance. These RF chip inductors are compact in size and feature lead-free tin plated nickel barrier terminations and tape and reel packaging which makes them ideal for small size/high volume wireless applications.
Applications:
- CELL/PCS Modules
- Wireless LAN
- Broadband Components
- RFID
- RF transceivers
- RoHS Compliant (Standard, “V” Code)
- Sn/Pb Terminations Optional (“T” Code)
