-

Why use Fans for Air Cooling?
Improve the performance of your air cooled thermal management solution by increasing air flow and heat transfer with fans or blowers. When ambient environment or natural convection cooling cannot sustain enough heat transfer for higher power applications, fans and forced air convection cooling are designed to manipulate this environment. Increased airflow to forced convection heat sinks enable engineers to dissipate more heat load within a similar volume.
-

Heat spreaders are an ideal solution for rapidly and evenly distributing high density heat loads. Heat spreaders are often used to increase heat distribution to additional surface area like heat sinks or heat exchangers, which improves the overall thermal performance of the assembly. As a passive solution, heat spreaders and conductive chassis don’t require moving components, meaning high reliability, less wear and tear, and low maintenance.
-

Semiconductor sockets are specialized devices that interface the semiconductor device under test (DUT) to test equipment, enabling precise and efficient testing of semiconductor components
-

Thermal Simulation Free thermal simulation Thermal Consulting Optimized design Customized prototype With the shortened development cycle of electronic products and high-density component design, T-Global Technology not only provides thermal dissipation parts for different needs of customers, but also provides a full range of thermal engineering solutions consulting. We have the best thermal simulation software and...